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scls103e ? march 1984 ? revised july 2003 1 post office box 655303 ? dallas, texas 75265 wide operating voltage range of 2 v to 6 v high-current 3-state outputs interface directly with system bus or can drive up to 15 lsttl loads low power consumption, 80- a max i cc typical t pd = 11 ns 6-ma output drive at 5 v low input current of 1 a max 1 2 3 4 5 6 7 14 13 12 11 10 9 8 1oe 1a 1y 2oe 2a 2y gnd v cc 4oe 4a 4y 3oe 3a 3y 3212019 910111213 4 5 6 7 8 18 17 16 15 14 4a nc 4y nc 3oe 1y nc 2oe nc 2a 1a 1oe nc 3y 3a v 4oe 2y gnd nc sn54hc126 ...fk p ackage (top view) cc nc ? no internal connection sn54hc126 ...j or w p ackage sn74hc126 . . . d, db, n, ns, or pw package (top view) description/ordering information these quadruple bus buffer gates feature independent line drivers with 3-state outputs. each output is disabled when the associated output-enable (oe) input is low. to ensure the high-impedance state during power up or power down, oe should be tied to gnd through a pullup resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. ordering information t a package ? orderable part number top-side marking pdip ? n tube of 25 sn74hc126n sn74hc126n tube of 50 sn74hc126d soic ? d reel of 2500 sn74hc126dr hc126 soic ? d reel of 250 sn74hc126dt hc126 ?40 c to 85 c sop ? ns reel of 2000 sn74hc126nsr hc126 ?40 c to 85 c ssop ? db reel of 2000 sn74hc126dbr hc126 tube of 90 sn74hc126pw tssop ? pw reel of 2000 sn74hc126pwr hc126 tssop ? pw reel of 250 sn74hc126pwt hc126 cdip ? j tube of 25 SNJ54HC126J SNJ54HC126J ?55 c to 125 c cfp ? w tube of 150 snj54hc126w snj54hc126w ?55 c to 125 c lccc ? fk tube of 55 snj54hc126fk snj54hc126fk ? package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. please be aware that an important notice concerning avail ability, standard warranty, and use in critical applications o f texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. copyright ? 2003, texas instruments incorporated
scls103e ? march 1984 ? revised july 2003 2 post office box 655303 ? dallas, texas 75265 function table (each buffer) inputs output oe a output y h h h h ll l x z logic diagram (positive logic) 1 1oe 2 1a 1y pin numbers shown are for the d, db, j, n, ns, pw, and w packages. 3 4 2oe 5 2a 2y 6 10 3oe 9 3a 3y 8 13 4oe 12 4a 4y 11 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) ? supply voltage range, v cc ?0.5 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input clamp current, i ik (v i < 0 or v i > v cc ) (see note 1) 20 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . output clamp current, i ok (v o < 0 or v o > v cc ) (see note 1) 20 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous output current, i o (v o = 0 to v cc ) 35 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous current through v cc or gnd 70 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . package thermal impedance, ja (see note 2): d package 86 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . db package 96 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . n package 80 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ns package 76 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . pw package 113 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg ?65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, a nd functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditi ons? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. notes: 1. the input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. the package thermal impedance is calculated in accordance with jesd 51-7.
scls103e ? march 1984 ? revised july 2003 3 post office box 655303 ? dallas, texas 75265 recommended operating conditions (see note 3) sn54hc126 sn74hc126 unit min nom max min nom max unit v cc supply voltage 2 5 6 2 5 6 v v cc = 2 v 1.5 1.5 v ih high-level input voltage v cc = 4.5 v 3.15 3.15 v v ih high-level input voltage v cc = 6 v 4.2 4.2 v v cc = 2 v 0.5 0.5 v il low-level input voltage v cc = 4.5 v 1.35 1.35 v v il low-level input voltage v cc = 6 v 1.8 1.8 v v i input voltage 0 v cc 0 v cc v v o output voltage 0 v cc 0 v cc v v cc = 2 v 1000 1000 ? t/ ? v input transition rise/fall time v cc = 4.5 v 500 500 ns ? t/ ? v input transition rise/fall time v cc = 6 v 400 400 ns t a operating free-air temperature ?55 125 ?40 85 c note 3: all unused inputs of the device must be held at v cc or gnd to ensure proper device operation. refer to the ti application report, implications of slow or floating cmos inputs , literature number scba004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) parameter test conditions v cc t a = 25 c sn54hc126 sn74hc126 unit parameter test conditions v cc min typ max min max min max unit 2 v 1.9 1.998 1.9 1.9 i oh = ?20 a 4.5 v 4.4 4.499 4.4 4.4 v oh v i = v ih or v il i oh = ?20 a 6 v 5.9 5.999 5.9 5.9 v v oh v i = v ih or v il i oh = ?6 ma 4.5 v 3.98 4.3 3.7 3.84 v i oh = ?7.8 ma 6 v 5.48 5.8 5.2 5.34 2 v 0.002 0.1 0.1 0.1 i ol = 20 a 4.5 v 0.001 0.1 0.1 0.1 v ol v i = v ih or v il i ol = 20 a 6 v 0.001 0.1 0.1 0.1 v v ol v i = v ih or v il i ol = 6 ma 4.5 v 0.17 0.26 0.4 0.33 v i ol = 7.8 ma 6 v 0.15 0.26 0.4 0.33 i i v i = v cc or 0 6 v 0.1 100 1000 1000 na i oz v o = v cc or 0 6 v 0.01 0.5 10 5 a i cc v i = v cc or 0, i o = 0 6 v 8 160 80 a c i 2 v to 6 v 3 10 10 10 pf
scls103e ? march 1984 ? revised july 2003 4 post office box 655303 ? dallas, texas 75265 switching characteristics over recommended operating free-air temperature range, c l = 50 pf (unless otherwise noted) (see figure 1) parameter from to v cc t a = 25 c sn54hc126 sn74hc126 unit parameter from (input) to (output) v cc min typ max min max min max unit 2 v 47 120 180 150 t pd a y 4.5 v 14 24 36 30 ns t pd a y 6 v 11 20 31 26 ns 2 v 57 120 180 150 t en oe y 4.5 v 16 24 36 30 ns t en oe y 6 v 12 20 31 26 ns 2 v 35 120 180 150 t dis oe y 4.5 v 17 24 36 30 ns t dis oe y 6 v 15 20 31 26 ns 2 v 28 60 90 75 t t any 4.5 v 8 12 18 15 ns t t any 6 v 6 10 15 13 ns switching characteristics over recommended operating free-air temperature range, c l = 150 pf (unless otherwise noted) (see figure 1) parameter from to v cc t a = 25 c sn54hc126 sn74hc126 unit parameter from (input) to (output) v cc min typ max min max min max unit 2 v 67 150 225 188 t pd a y 4.5 v 19 30 45 38 ns t pd a y 6 v 15 25 39 33 ns 2 v 100 135 202 169 t en oe y 4.5 v 20 27 40 36 ns t en oe y 6 v 17 23 36 30 ns 2 v 45 210 315 265 t t any 4.5 v 17 42 63 53 ns t t any 6 v 13 36 53 45 ns operating characteristics, t a = 25 c parameter test conditions typ unit c pd power dissipation capacitance per gate no load 45 pf
scls103e ? march 1984 ? revised july 2003 5 post office box 655303 ? dallas, texas 75265 parameter measurement information voltage waveform input rise and fall times 50% 50% 10% 10% 90% 90% v cc 0 v t r t f input voltage waveforms propagation delay and output transition times 50% 50% 50% 10% 10% 90% 90% v cc v oh v ol 0 v t r t f input in-phase output 50% t plh t phl 50% 50% 10% 10% 90% 90% v oh v ol t r t f t phl t plh out-of-phase output 10% 90% v cc v cc v ol 0 v output control output waveform 1 (see note b) t pzl t plz voltage waveforms enable and disable times for 3-state outputs v oh 0 v 50% 50% t pzh t phz output waveform 2 (see note b) test point from output under test c l (see note a) r l v cc s1 s2 load circuit parameter c l t pzh t pd or t t t dis t en t pzl t phz t plz 1 k ? 1 k ? 50 pf or 150 pf 50 pf open closed r l s1 closed open s2 open closed closed open 50 pf or 150 pf open open ?? notes: a. c l includes probe and test-fixture capacitance. b. waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. c. phase relationships between waveforms were chosen arbitrarily. all input pulses are supplied by generators having the followi ng characteristics: prr 1 mhz, z o = 50 ? , t r = 6 ns, t f = 6 ns. d. the outputs are measured one at a time with one input transition per measurement. e. t plz and t phz are the same as t dis . f. t pzl and t pzh are the same as t en . g. t plh and t phl are the same as t pd . 50% 50% figure 1. load circuit and voltage waveforms
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 5962-86848012a active lccc fk 20 1 tbd post-plate n / a for pkg type 5962-8684801ca active cdip j 14 1 tbd a42 snpb n / a for pkg type sn54hc126j active cdip j 14 1 tbd a42 snpb n / a for pkg type sn74hc126d active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126dble obsolete ssop db 14 tbd call ti call ti sn74hc126dbr active ssop db 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126dbre4 active ssop db 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126dbrg4 active ssop db 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126de4 active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126dg4 active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126dr active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126dre4 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126drg4 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126dt active soic d 14 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126dte4 active soic d 14 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126dtg4 active soic d 14 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126n active pdip n 14 25 pb-free (rohs) cu nipdau n / a for pkg type sn74hc126n3 obsolete pdip n 14 tbd call ti call ti sn74hc126ne4 active pdip n 14 25 pb-free (rohs) cu nipdau n / a for pkg type sn74hc126nsr active so ns 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126nsre4 active so ns 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126nsrg4 active so ns 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126pw active tssop pw 14 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126pwe4 active tssop pw 14 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126pwg4 active tssop pw 14 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126pwr active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126pwre4 active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim package option addendum www.ti.com 9-oct-2007 addendum-page 1
orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) sn74hc126pwrg4 active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126pwt active tssop pw 14 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126pwte4 active tssop pw 14 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74hc126pwtg4 active tssop pw 14 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim snj54hc126fk active lccc fk 20 1 tbd post-plate n / a for pkg type SNJ54HC126J active cdip j 14 1 tbd a42 snpb n / a for pkg type (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 9-oct-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74hc126dbr ssop db 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 q1 sn74hc126dr soic d 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 q1 sn74hc126nsr so ns 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 q1 sn74hc126pwr tssop pw 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) sn74hc126dbr ssop db 14 2000 346.0 346.0 33.0 sn74hc126dr soic d 14 2500 346.0 346.0 33.0 sn74hc126nsr so ns 14 2000 346.0 346.0 33.0 sn74hc126pwr tssop pw 14 2000 346.0 346.0 29.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2
mechanical data msso002e ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 db (r-pdso-g**) plastic small-outline 4040065 /e 12/01 28 pins shown gage plane 8,20 7,40 0,55 0,95 0,25 38 12,90 12,30 28 10,50 24 8,50 seating plane 9,90 7,90 30 10,50 9,90 0,38 5,60 5,00 15 0,22 14 a 28 1 20 16 6,50 6,50 14 0,05 min 5,90 5,90 dim a max a min pins ** 2,00 max 6,90 7,50 0,65 m 0,15 0 ? 8 0,10 0,09 0,25 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-150

mechanical data mlcc006b october 1996 post office box 655303 ? dallas, texas 75265 fk (s-cqcc-n**) leadless ceramic chip carrier 4040140 / d 10/96 28 terminal shown b 0.358 (9,09) max (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) a no. of min max 0.358 0.660 0.761 0.458 0.342 (8,69) min (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32) (18,78) ** 20 28 52 44 68 84 0.020 (0,51) terminals 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 12 13 14 15 16 18 17 11 10 8 9 7 5 4 3 2 0.020 (0,51) 0.010 (0,25) 6 1 28 26 27 19 21 b sq a sq 22 23 24 25 20 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. this package can be hermetically sealed with a metal lid. d. the terminals are gold plated. e. falls within jedec ms-004

mechanical data mtss001c january 1995 revised february 1999 post office box 655303 ? dallas, texas 75265 pw (r-pdso-g**) plastic small-outline package 14 pins shown 0,65 m 0,10 0,10 0,25 0,50 0,75 0,15 nom gage plane 28 9,80 9,60 24 7,90 7,70 20 16 6,60 6,40 4040064/f 01/97 0,30 6,60 6,20 8 0,19 4,30 4,50 7 0,15 14 a 1 1,20 max 14 5,10 4,90 8 3,10 2,90 a max a min dim pins ** 0,05 4,90 5,10 seating plane 0 8 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-153

important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers 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